Micro focus X-rays can pass through plastic packaging materials and image the metal components inside the packaging. For high-tech electronic components that have emerged one after another, due to the inability to directly observe short circuits and open circuits in the internal electronic circuits, surface detection can no longer meet the current customer's testing requirements. Therefore, high-performance real-time X-ray detection is so important and effective.
● Operability
The interface layout is simple and easy to understand, with enlarged images for more direct completion of tasks.
Clear images
The PDA tablet detector combined with image processing technology produces clear images without deformation.
● Tilt perspective
Perspective from an oblique direction can reveal defects that cannot be detected by vertical perspective.
● Standard measurement functions
·Dimensional measurement
Including the measurement of distance, angle, and curvature between 2 points. Previously, size calibration was required for each image, but now the system links it with magnification and automatically calculates calibration data, enabling efficient size measurement.
·BGA Bubble Rate Measurement
After setting the critical value, click on the measurement icon, and the system will automatically measure and display all voids on the image. The system can also automatically determine whether it is qualified or not based on pre-set standards, and the measurement results can also be saved in CSV format.
·Area ratio measurement
Used to measure the wetting ratio of solder paste on solder joints or pads. The system measures the ratio of the target area within a specified ROI (user specified area). The area ratio refers to the value of the target area/ROI area.
·Measurement of curvature of gold wire
Determine the positions of the two ends and the maximum curvature point of the gold wire, and the system can calculate the curvature of the gold wire based on this. This measurement result can also be saved in CSV format.
application area
Electronic components, circuit components
• Gold wire pin connection fault points, spherical virtual solder joints, gold wire curvature, chip bonding, dry bonding, bridging/short circuiting, internal bubbles, BGA, etc
• Pre assembly/post assembly PCB
Position deviation of parts, display of defects such as weld gaps, bridging, surface assembly, etc
Through hole coating, detailed inspection of multi-layer arrangement
Wafer level chip scale packaging (WLCSP)
BGA and CSP testing
Non lead soldering inspection
Micro electromechanical systems (MEMS), micro electromechanical systems (MOEMS)
• Cables, connectors, plastic parts, etc